Although my school background is technical, my professional experience covers much more. I have been working in various divisions of different companies, among which technical departments (inc. R&D) but marketing department as well. I moved to management roles with international dimension teams and projects.
Currently Head of Standards and Advanced Technology at LG Electronics European Labs, I am involved in managing a department (budget, teams management). I contribute to Europe board of directors and strategy discussions in my company (products and technology).
Part of my activity is related to European, World and Industry standardisation development organisations. Initially contributor in the groups, I am now elected chairman (resp. vice chairman) of ETSI SCP TEC (resp 3GPP CT6). I am also the main contact for LG Electronics at ETSI representing my company at General Assembly.
My expertise is recognized internally, I even been awarded of LG Electronics UICC/SIM Maestro, i.e. the expert in charge of keeping and sharing knowledge within the company. I also participated to reference book writing under the direction of Xavier Lagrange, Professor of the French National Telecommunication School. Additionnaly, I appreciated having the opportunity to teach in Engineer schools aside my main work.
I now aim at continuously developing my management skills, to increase my activity in participating to set up the strategy for my company and to remain at a good technical expertise level.
I am leading at the LG Electronics Europe Lab, the Standards and Advanced Technology team. The team aims at contributing to standardisation activity, internal expertise building, new technologies prototyping and support to Techinal Account / Global Account / Marketing teams.
Standardisation activity includes new technologies follow-up, patent creation, contribution to multiple standard bodies (3GPP, ETSI, OMA, GSMA, etc.). The team is recognized for its top expertise level and knowledge of trends. As such it contributes to build strategy for future products/technologies implementations.
Project Managers in the team are also involved in the development of prototypes for European Operators/Partners to demonstrate the advanced technology before full standardisation or right when standard is approved. This includes technologies such as NFC, LTE, Mobile TV, Large SIMs, etc..
This group is in charge of creating and maintaining technical specification for a telecommuncations smart card platform. Among the achievements of this group, Contactless UICC interface, M2M form factor, Interchip USB interface.
I have been elected chairman of the TEChnical working group of the ETSI Smart Card Platform committee since Autumn 2004.
This standardisation group is in charge of specifying the smart card applications for 3GPP, including SIM, USIM, ISIM and others.
This group was created from 3GPP TSG T WG3 when 3GPP groups were re-structured in 2004. I was at that period vice chairman of T3 and have been elected vice-chairman of this new group at its creation.
I act as well (since 2010) as official liaison between 3GPP and ETSI SCP to track the changes in their specification and allow to identify the possible mismatches.
I have been in charge of different training modules for Telecom ParisTech both in the Engineer and Professionnal training cycles. Topics have been: SIM card for telecommunications, WAP, etc..
In charge of the course on Mobile Handsets (hardware, architecture, software and devices) withinin the Mobility Services module of the engineer studies' last year.
Responsible of standardisation follow-up for mobile handsets and SIM cards, I contributed to 3GPP, ETSI and OMA (WAP Forum) meetings. My mission was also covering the broadcast of information in the different parts of the company and a role of advisor in the supplier choice for SIM cards.
3GPP TSG T3 is the group in charge of smart card application, typically specifying SIM and USIM application for smart cards (UICC).
The main achievements of the groups were SIM maintenance, USIM and ISIM (IMS SIM) specification, evolution of the phonebook toward contact manager and integration of SIM aspects for new 3GPP services.
I have been elected early 2000 vice-chairman of the group and kept the position until the group closure due to a re-structuration of 3GPP groups.
De La Rue Card Systems (now Oberthur Technologies) is a leading smart card manufacturer, developping products in telecommunication, but also in banking or identity lines.
I joined the company to be Product Manager of the Prepaid SIM cards. I have been involed in Direct Connect project, then later on SICAP (Swisscom prepaid solution).
When the market came to WAP (now OMA) and 3G, still as a Product Manager (reporting in the Marketing division), I have been working on the 3G products and WAP developments.
Within the Value Added Service department of the Technical Division, I worked on the introduction of proactive (Phase 2+ / SIM Toolkit) cards and the related Other The Air server to update them.
Another achievement has been the introduction of an offer grouping the first PDAs (PSION) with a mobile handset subscription, which can be seen as the first work on a smartphone.